Optoelectronic Interconnects VII ; Photonics Packaging and Integration II

Optoelectronic Interconnects VII ; Photonics Packaging and Integration II

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Even though new designs with higher bandwidths are being developed, each bandwidth enhancement requires new connector and printed wiring board designs; and hence, the replacement of the existing interconnect infrastructure.


Title:Optoelectronic Interconnects VII ; Photonics Packaging and Integration II
Author: Michael R. Feldman
Publisher:Society of Photo Optical - 2000
ISBN-13:

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